Memory (FBGA)

Items Available Road Map
Y2018-1H Y2018-2H Y2019
PKG Thickness (mm) 0.55 0.47 0.45
Max. Die Number 10 11 12 17
Min. Die Thickness (um) 40 30 25
DAF Thickness (um) 10
PCB Thickness (mm) 0.09 0.08
Mold Cap (mm)

뼧 Transfer
0.25 0.22
Pattern Layer (NAND) 48stack 64stack
Flip Chip

Items Available Road Map
Y2018-1H Y2018-2H Y2019
Die Size (mm) 11.5×11.5mm 14.0×14.0mm 18.0×18.0mm 20.0×20.0mm
Bump Pitch (um)

뼧 Pb Free Solder

뼧 Cu Pillar + Pb Free Solder
 

134.9um

60um
 

130um

40um
 

130um

40um
 

120um

30um
뼧 Max Body size

뼧 Min Ball size (Strip/Unit)

뼧 Min Ball Pitch (Strip/Unit)
35x35mm

0.15/0.25mm

0.30/0.40mm
55x55mm

0.15/0.25mm

0.30/0.40mm
75x75mm

0.15/0.25mm

0.30/0.40mm
90x90mm

0.15/0.25mm

0.30/0.40mm
Substrate Standard Core

Low CTE Core

Coreless
- - -
QFN/FLGA

Items Available Road Map
Y2018-1H Y2018-2H Y2019
QFN PKG Size (mm) 3×3~8×8 3×3~11×11 2×2~13×13
FBGA PKG thickness(mm) 0.45 0.41 0.35 0.30
FLGA PKG Size (mm) 3×3~ 2×2.5~ 2×2~
Overhang @50um die(mm) 0.8 1.2 1.5 2.0
Loop Height (um) 30 25 25 23
Bump / WLP

Items Available Road Map
HVM AVM Y2018-1H Y2018-2H Y2019
Wafer size 200mm 200mm/300mm
RDL Line & Space (Min.) 15um/15um 9um/9um 9um/9um 8um/8um 8um/8um
RDL Max. thickness

(Cu portion, 1chip)
9um 20um 20um 30um
(돞50%) (돞70%) (돞70%)
PI/PBO Min. CD size(Min.) 22um/20um 20um/15um 20um/12um 15um/10um
PI/PBO thickness(Max.) 10um/10um 20um/10um 20um/10um 30um/10um 20um/10um
Min. Ball pitch Ball 400um 350um 300um 250um -
L/F 150um 100um 100um - -
Low stress solution Reduction of wafer warpage & Bump process control
Thermal stress solution Low cure passivation(돞 230꼦) Low cure passivation(돞 200꼦)
High current solution UBM thickness 8um/10um/15um/20um
Design

Items Available Road Map
Y2018-1H Y2018-2H Y2019
Line & Space (um) 9/12um 10/10um 8/8um
Via / Via Pad (um)

뼧 Blind Via
60/90um 55/80um 50/70um
SRO/SRR

뼧 SR Open

뼧 SR Registration

뼧 SOP Pitch
70짹10um

130um
60짹9.5um

110um
<60짹9.5um

100um
Stack Via 2~4 Stack 5 Stack 6 Stack
Core Material E700/705G,R1515W E770G, R1515U Low CTE New material
Build-Up Material GX13, GX92 GZ41, GL102 GX-T37, GY16B
Solder Mask Material AUS703, SR1 SR2, FZ2700 SR3, SR-FB
Surface Finish ENIG,OSP, IT, ENEPIG Selective ENEPIG Low cost Chemical